Miniaturization Solutions for All Stages of Product
Lifecycle
EWA GSI’s Miniaturization Design Center supports customers
whose products are at different levels of product maturity.
We are practiced
in assisting customers at any stage in a product’s lifecycle. We are
experienced solutions providers for:
• New
Concepts & Designs-
Design and
prototype to verify product functionality, then miniaturize using microelectronics
technology to create a smaller and more energy-efficient form factor.
• Existing Devices Requiring Miniaturization -
Reduction of circuit board(s) as well as development of microelectronics that
are integrated into smaller, lower power, reduced weight form factors.
• Older Technology
Designs -
Convert existing / legacy design(s) into
newer optimal microelectronics technology, often permitting the introduction
of additional capability and performance.
• Microelectronic
Designs Requiring Fabrication -
Serve as a "second
source" for
fabrication of existing chipset design (in a current technology).
Complete In-House Development Capability
EWA GSI provides comprehensive
design and development to include: logical design, synthesis, simulation,
physical design, layout, verification, submission to foundry, package
design and implementation, test & evaluation, and
characterization.
100% Domestic Microelectronics Offerings
EWA GSI’s current microelectronic
offerings allow us to select and implement the technology that best meets
the customer’s performance
and cost requirements:
• Application Specific
Integrated Circuit (ASIC)
• Digital
Devices
• Mixed Signal (Analog
/ Digital) Devices
• Microwave Monolithic
Integrated Circuit (MMICs)
• Radio Frequency
(RF) Devices
EWA GSI’s has established
teaming agreements/contracts with leading domestic foundries and packaging
vendors to support custom / low volume runs as well as high volume
production runs.
• ASIC "chip" foundry,
located in Vermont, has been certified as a "Trusted Foundry" by
NSA
• Trusted MMIC “chip” foundry
facilities in Oregon and Texas
Available in a range of
transistor sizes (0.5 μm – 45
nm) and process technologies to include:
• CMOS / RF CMOS
• Silicon-On-Insulator
• Silicon
Germanium (SiGe)
• Gallium Arsenide
(GaAs) / Gallium Nitride (GaN)
Additional Area Information:
| Area Events | Attractions | Arts | Recreation | Historic Sites | VT Products | Lodging | Dining
Central Vermont Chamber of Commerce
Used with Permission © 2010.
All rights reserved.
CV Chamber / P.O. Box 336 / Barre, Vermont 05641
WebMaster/CV Chamber: (802)-229-4619
GO TO:
